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Micro and nanofabrication facility obtains 1600 square meters clean room in Class-100 and Class-1000, with over 20 advanced fabrication equipment and its optimized process. Technical services are provided for the research and lecturing by the experienced engineering team.

The facility consists advanced equipment such as Nanobeam e-beam lithography system, SUSS contact mask aligner, Picosun Atomic Layer Deposition (ALD), Lesker sputter system, e-beam evaporation, dual-chamber sputter deposition, Inductively Coupled Plasma (ICP) etching, Reactive Ion Etching, Rapid Thermal Process, LPCVD, Muffle furnaceWetbench, spin coater, oven, etc. Measurement tools are also available such as Spectroscopic Ellipsometer, desktop SEM, four-point-prober, eTester, etc.

Micro- and Nanofabrication facility has established the process flow and recipes in thin film deposition, photolithography, etching and integration modules. Professional engineering team is available to maintain the equipment for reliable process.

The equipment and process techniques in the Micro- and Nanofabrication facility is available to (1) research advanced electronic devices in micro- and nano-scale, (2) fabricate sensors and MEMS, (3) proceed the research and development on the 3rd generation semiconductor power devices, (4) prepare the novel low dimension electronic materials in atomic scale.

           Customers can reserve equipment and process services. Superuser is authorized to frequent operation users and is qualified for independent operation. Corporation is welcome for potential process and advanced devices for important research projects. Long term cooperation is feasible to develop novel process and devices.